Non-Silicone Thermal Conductive Pad PC94 | T-Global Thermal Technology
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Home > Products > Non-Silicone Thermal Conductive Pad > PC94 Non-Silicone Thermal Conductive Pad

Thermal Paste

pre-cut for different shape.

MSDS ROHS UL

PC94 Non-Silicone Thermal Conductive Pad

Feature

  • Low contact thermal impedance
  • Good thermal conductivity
  • Silicone free
  • Long term stability

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

Thermal Impedance V.S Pressure (mouse over)

Thermal Pad Non-silicone Thermal Pad
Property PC94 Unit Tolerance Test Method
Thermal Conductivity
4
W / mK
±0.4
ASTM D5470
Color
Red
-
-
Visual
Thickness (the thickness can be ordered)
0.5~5.0
mm
-
ASTM D374
0.0197~0.1969
inch
-
ASTM D374
Flame Rating
V-0
-
-
UL 94
Dielectric Breakdown Voltage
10
KV / mm
-
ASTM D149
Weight Loss
<1
%
-
ASTM E595
Specific Gravity
2.5
g / cm3
±0.2
ASTM D792
Working Temperature
-30~+125
°C
-
-
Volume Resistance
1010
Ohm-cm
-
ASTM D257
Elongation
100
%
-
ASTM D412
Tensile Strength
2
Kgf / cm2
-
ASTM D412
Standard Shape
Sheet ones
-
-
-
Hardness
60
Shore 00
±10
ASTM D2240

Thermal Adhesive TapeREACH Compliant Thermal Paste ManufacturerRoHS Compliant Thermal Paste ManufacturerUL Compliant

     

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Pre-cut for different shapes

 


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