Thermal Conductive Pad L37-3F | T-Global Thermal Technology
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Home > Products > Thermally Conductive Silicone Interface Pads > L37 Series Thermal Conductive Pad > L37-3F Thermal Conductive Pad

Thermal Adhesive Tape

Available to apply adhesive,
pre-cut for different shape.

DATASHEET MSDS ROHS UL 非矽導熱材

L37-3F Thermal Conductive Pad

Feature

  • Good thermal conductivity
  • Ultra soft and high compressibility
  • Natural tack
  • Easy to assemble
  • Good insulator

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

Thermal Impedance V.S Pressure (mouse over)

Thermal Compound Gap Filler
Property L37-3F Unit Tolerance Test Method

Color

Yellow

-

-

Visual

Thickness

0.25/ 0.3 /0.45

mm

-

ASTM D374

0.0098/ 0.0118 / 0.0177

inch

-

ASTM D374

Thermal Conductivity

1.4

W / mK

-

ASTM D5470

Flame Rating

V-0

-

-

UL 94

Dielectric Breakdown Voltage

3 / 4 / 5

KV / mm

_

ASTM D149

Weight Loss

<1

%

-

ASTM E595

Specific Gravity

2.0

g / cm³

±0.2

ASTM D792

Working Temperature

-40 ~ +200

-

-

Volume Resistance

>10¹³

Ohm-cm

-

ASTM D257

Elongation

5

%

±13

ASTM D412

Tensile Strength

150

Kgf / cm²

±2

ASTM D412

Standard shape

-

Sheet ones

-

-

Hardness

80

Shore A

±8

ASTM D2240

Thermal Paste ManufacturerREACH Compliant Ceramic Heat SpreaderRoHS Compliant Ceramic Heat SpreaderUL Compliant

     

Need samples?

Available to apply adhesive

Pre-cut for different shapes